View XC2V1000_46227.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

0
R
Virtex-II 1.5V Field-Programmable Gate Arrays
0 0
DS031-1 (v1.7) October 2, 2001
Advance Product Specification
Summary of Virtex(R)-II Features
* * Industry First Platform FPGA Solution IP-ImmersionTM Architecture - Densities from 40K to 8M system gates - 420 MHz internal clock speed (Advance Data) - 840+ Mb/s I/O (Advance Data) SelectRAMTM Memory Hierarchy - 3 Mb of True Dual-PortTM RAM in 18-Kbit block SelectRAM resources - Up to 1.5 Mb of distributed SelectRAM resources - High-performance interfaces to external memory * DDR-SDRAM interface * FCRAM interface * QDRTM-SRAM interface * Sigma RAM interface Arithmetic Functions - Dedicated 18-bit x 18-bit multiplier blocks - Fast look-ahead carry logic chains Flexible Logic Resources - Up to 93,184 internal registers / latches with Clock Enable - Up to 93,184 look-up tables (LUTs) or cascadable 16-bit shift registers - Wide multiplexers and wide-input function support - Horizontal cascade chain and Sum-of-Products support - Internal 3-state bussing High-Performance Clock Management Circuitry - Up to 12 DCM (Digital Clock Manager) modules * Precise clock de-skew * Flexible frequency synthesis * High-resolution phase shifting - 16 global clock multiplexer buffers Active InterconnectTM Technology - Fourth generation segmented routing structure - Predictable, fast routing delay, independent of fanout SelectI/O-UltraTM Technology - Up to 1,108 user I/Os - 19 single-ended standards and six differential standards - Programmable sink current (2 mA to 24 mA) per I/O Digitally Controlled Impedance (DCI) I/O: on-chip termination resistors for single-ended I/O standards - PCI-X @ 133 MHz, PCI @ 66 MHz and 33 MHz compliance, and CardBus compliant - Differential Signaling * 840 Mb/s Low-Voltage Differential Signaling I/O (LVDS) with current mode drivers * Bus LVDS I/O * Lightning Data Transport (LDT) I/O with current driver buffers * Low-Voltage Positive Emitter-Coupled Logic (LVPECL) I/O * Built-in DDR Input and Output registers - Proprietary high-performance SelectLinkTM Technology * High-bandwidth data path * Double Data Rate (DDR) link * Web-based HDL generation methodology Supported by Xilinx FoundationTM and AllianceTM Series Development Systems - Integrated VHDL and Verilog design flows - Compilation of 10M system gates designs - Internet Team Design (ITD) tool SRAM-Based In-System Configuration - Fast SelectMAPTM configuration - Triple Data Encryption Standard (DES) security option (Bitstream Encryption) - IEEE1532 support - Partial reconfiguration - Unlimited re-programmability - Readback capability 0.15 m 8-Layer Metal process with 0.12 m high-speed transistors 1.5 V (VCCINT) core power supply, dedicated 3.3 V VCCAUX auxiliary and VCCO I/O power supplies IEEE 1149.1 compatible boundary-scan logic support Flip-Chip and Wire-Bond Ball Grid Array (BGA) packages in three standard fine pitches (0.80mm, 1.00mm, and 1.27mm) 100% factory tested -
*
*
*
*
*
*
* * * *
*
*
*
(c) 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS031-1 (v1.7) October 2, 2001 Advance Product Specification
www.xilinx.com 1-800-255-7778
Module 1 of 4 1
Virtex-II 1.5V Field-Programmable Gate Arrays
R
Table 1: Virtex-II Field-Programmable Gate Array Family Members CLB (1 CLB = 4 slices = Max 128 bits) System Gates 40K 80K 250K 500K 1M 1.5M 2M 3M 4M 6M 8M Array Row x Col. 8x8 16 x 8 24 x 16 32 x 24 40 x 32 48 x 40 56 x 48 64 x 56 80 x 72 96 x 88 112 x 104 Maximum Distributed RAM Kbits 8 16 48 96 160 240 336 448 720 1,056 1,456 Multiplier Blocks 4 8 24 32 40 48 56 96 120 144 168 SelectRAM Blocks 18-Kbit Blocks 4 8 24 32 40 48 56 96 120 144 168 Max RAM (Kbits) 72 144 432 576 720 864 1,008 1,728 2,160 2,592 3,024 Max I/O Pads(1) 88 120 200 264 432 528 624 720 912 1,104 1,108
Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000
Slices 256 512 1,536 3,072 5,120 7,680 10,752 14,336 23,040 33,792 46,592
DCMs 4 4 8 8 8 8 8 12 12 12 12
Notes: 1. See details in Table 2, "Maximum Number of User I/O Pads".
General Description
The Virtex-II family is a platform FPGA developed for high performance from low-density to high-density designs that are based on IP cores and customized modules. The family delivers complete solutions for telecommunication, wireless, networking, video, and DSP applications, including PCI, LVDS, and DDR interfaces. The leading-edge 0.15m / 0.12m CMOS 8-layer metal process and the Virtex-II architecture are optimized for high speed with low power consumption. Combining a wide variety of flexible features and a large range of densities up to 10 million system gates, the Virtex-II family enhances programmable logic design capabilities and is a powerful alternative to mask-programmed gates arrays. As shown in Table 1, the Virtex-II family comprises 12 members, ranging from 40K to 10M system gates. Table 2 shows the maximum number of user I/Os available. The Virtex-II device/package combination table (Table 6 at the end of this section) details the maximum number of I/Os for each device and package using wire-bond or flip-chip technology. Table 2: Maximum Number of User I/O Pads Device XC2V40 XC2V80 XC2V250 XC2V500 XC2V1000 XC2V1500 XC2V2000 XC2V3000 XC2V4000 XC2V6000 XC2V8000 Wire-Bond 88 120 200 264 328 392 456 516 432 528 624 720 912 1,104 1,108 Flip-Chip
Packaging
Offerings include ball grid array (BGA) packages with 0.80mm, 1.00mm, and 1.27mm pitches. In addition to traditional wire-bond interconnects, flip-chip interconnect is used in some of the BGA offerings. The use of flip-chip interconnect offers more I/Os than is possible in wire-bond versions of the similar packages. Flip-Chip construction offers the combination of high pin count with high thermal capacity.
Module 1 of 4 2
www.xilinx.com 1-800-255-7778
DS031-1 (v1.7) October 2, 2001 Advance Product Specification
R
Virtex-II 1.5V Field-Programmable Gate Arrays
Architecture
Virtex-II Array Overview
Virtex-II devices are user-programmable gate arrays with various configurable elements. The Virtex-II architecture is optimized for high-density and high-performance logic designs. As shown in Figure 1, the programmable device is comprised of input/output blocks (IOBs) and internal configurable logic blocks (CLBs).
DCM Global Clock Mux DCM IOB
Configurable Logic
Programmable I/Os CLB Block SelectRAM Multiplier
DS031_28_100900
Figure 1: Virtex-II Architecture Overview Programmable I/O blocks provide the interface between package pins and the internal configurable logic. Most popular and leading-edge I/O standards are supported by the programmable IOBs. The internal configurable logic includes four major elements organized in a regular array. * Configurable Logic Blocks (CLBs) provide functional elements for combinatorial and synchronous logic, including basic storage elements. BUFTs (3-state buffers) associated with each CLB element drive dedicated segmentable horizontal routing resources. Block SelectRAM memory modules provide large 18-Kbit storage elements of True Dual-Port RAM. Multiplier blocks are 18-bit x 18-bit dedicated multipliers. DCM (Digital Clock Manager) blocks provide self-calibrating, fully digital solutions for clock distribution delay compensation, clock multiplication and division, coarse and fine-grained clock phase shifting. All programmable elements, including the routing resources, are controlled by values stored in static memory cells. These values are loaded in the memory cells during configuration and can be reloaded to change the functions of the programmable elements.
Virtex-II Features
This section briefly describes Virtex-II features.
Input/Output Blocks (IOBs)
IOBs are programmable and can be categorized as follows: * * Input block with an optional single-data-rate or double-data-rate (DDR) register Output block with an optional single-data-rate or DDR register, and an optional 3-state buffer, to be driven directly or through a single or DDR register Bi-directional block (any combination of input and output configurations)
* * *
*
These registers are either edge-triggered D-type flip-flops or level-sensitive latches. IOBs support the following single-ended I/O standards: * * * * LVTTL, LVCMOS (3.3 V, 2.5 V, 1.8 V, and 1.5 V) PCI-X at 133 MHz, PCI (3.3 V at 33 MHz and 66 MHz) GTL and GTLP HSTL (Class I, II, III, and IV)
A new generation of programmable routing resources called Active Interconnect Technology interconnects all of these elements. The general routing matrix (GRM) is an array of routing switches. Each programmable element is tied to a switch matrix, allowing multiple connections to the general routing matrix. The overall programmable interconnection is hierarchical and designed to support high-speed designs.
DS031-1 (v1.7) October 2, 2001 Advance Product Specification
www.xilinx.com 1-800-255-7778
Module 1 of 4 3
Virtex-II 1.5V Field-Programmable Gate Arrays * * SSTL (3.3 V and 2.5 V, Class I and II) AGP-2X
R
The digitally controlled impedance (DCI) I/O feature automatically provides on-chip termination for each I/O element. The IOB elements also support the following differential signaling I/O standards: * * * * * LVDS BLVDS (Bus LVDS) ULVDS LDT LVPECL
A multiplier block is associated with each SelectRAM memory block. The multiplier block is a dedicated 18 x 18-bit multiplier and is optimized for operations based on the block SelectRAM content on one port. The 18 x 18 multiplier can be used independently of the block SelectRAM resource. Read/multiply/accumulate operations and DSP filter structures are extremely efficient. Both the SelectRAM memory and the multiplier resource are connected to four switch matrices to access the general routing resources.
Global Clocking
The DCM and global clock multiplexer buffers provide a complete solution for designing high-speed clocking schemes. Up to 12 DCM blocks are available. To generate de-skewed internal or external clocks, each DCM can be used to eliminate clock distribution delay. The DCM also provides 90-, 180-, and 270-degree phase-shifted versions of its output clocks. Fine-grained phase shifting offers high-resolution phase adjustments in increments of 1/256 of the clock period. Very flexible frequency synthesis provides a clock output frequency equal to any M/D ratio of the input clock frequency, where M and D are two integers. For the exact timing parameters, see VirtexTM-II Electrical Characteristics. Virtex-II devices have 16 global clock MUX buffers, with up to eight clock nets per quadrant. Each global clock MUX buffer can select one of the two clock inputs and switch glitch-free from one clock to the other. Each DCM block is able to drive up to four of the 16 global clock MUX buffers.
Two adjacent pads are used for each differential pair. Two or four IOB blocks connect to one switch matrix to access the routing resources.
Configurable Logic Blocks (CLBs)
CLB resources include four slices and two 3-state buffers. Each slice is equivalent and contains: * * * * * * * Two function generators (F & G) Two storage elements Arithmetic logic gates Large multiplexers Wide function capability Fast carry look-ahead chain Horizontal cascade chain (OR gate)
The function generators F & G are configurable as 4-input look-up tables (LUTs), as 16-bit shift registers, or as 16-bit distributed SelectRAM memory. In addition, the two storage elements are either edge-triggered D-type flip-flops or level-sensitive latches. Each CLB has internal fast interconnect and connects to a switch matrix to access general routing resources.
Routing Resources
The IOB, CLB, block SelectRAM, multiplier, and DCM elements all use the same interconnect scheme and the same access to the global routing matrix. Timing models are shared, greatly improving the predictability of the performance of high-speed designs. There are a total of 16 global clock lines, with eight available per quadrant. In addition, 24 vertical and horizontal long lines per row or column as well as massive secondary and local routing resources provide fast interconnect. Virtex-II buffered interconnects are relatively unaffected by net fanout and the interconnect layout is designed to minimize crosstalk. Horizontal and vertical routing resources for each row or column include: * * * * 24 long lines 120 hex lines 40 double lines 16 direct connect lines (total in all four directions)
Block SelectRAM Memory
The block SelectRAM memory resources are 18 Kb of True Dual-Port RAM, programmable from 16K x 1 bit to 512 x 36 bits, in various depth and width configurations. Each port is totally synchronous and independent, offering three "read-during-write" modes. Block SelectRAM memory is cascadable to implement large embedded storage blocks. Supported memory configurations for dual-port and single-port modes are shown in Table 3. Table 3: Dual-Port And Single-Port Configurations 16K x 1 bit 8K x 2 bits 4K x 4 bits 2K x 9 bits 1K x 18 bits 512 x 36 bits
Module 1 of 4 4
www.xilinx.com 1-800-255-7778
DS031-1 (v1.7) October 2, 2001 Advance Product Specification
R
Virtex-II 1.5V Field-Programmable Gate Arrays
Boundary Scan
Boundary scan instructions and associated data registers support a standard methodology for accessing and configuring Virtex-II devices that complies with IEEE standards 1149.1 - 1993 and 1532. A system mode and a test mode are implemented. In system mode, a Virtex-II device performs its intended mission even while executing non-test boundary-scan instructions. In test mode, boundary-scan test instructions control the I/O pins for testing purposes. The Virtex-II Test Access Port (TAP) supports BYPASS, PRELOAD, SAMPLE, IDCODE, and USERCODE non-test instructions. The EXTEST, INTEST, and HIGHZ test instructions are also supported.
Readback and Integrated Logic Analyzer
Configuration data stored in Virtex-II configuration memory can be read back for verification. Along with the configuration data, the contents of all flip-flops/latches, distributed SelectRAM, and block SelectRAM memory resources can be read back. This capability is useful for real-time debugging. The Integrated Logic Analyzer (ILA) core and software provides a complete solution for accessing and verifying Virtex-II devices.
Virtex-II Device/Package Combinations and Maximum I/O
Wire-bond and flip-chip packages are available. Table 4 and Table 5 show the maximum possible number of user I/Os in wire-bond and flip-chip packages, respectively. Table 6 shows the number of available user I/Os for all device/package combinations. * * * * * CS denotes wire-bond chip-scale ball grid array (BGA) (0.80 mm pitch). FG denotes wire-bond fine-pitch BGA (1.00 mm pitch). FF denotes flip-chip fine-pitch BGA (1.00 mm pitch). BG denotes standard BGA (1.27 mm pitch). BF denotes flip-chip BGA (1.27 mm pitch).
Configuration
Virtex-II devices are configured by loading data into internal configuration memory, using the following five modes: * * * * * Slave-serial mode Master-serial mode Slave SelectMAP mode Master SelectMAP mode Boundary-Scan mode (IEEE 1532)
A Data Encryption Standard (DES) decryptor is available on-chip to secure the bitstreams. One or two triple-DES key sets can be used to optionally encrypt the configuration information.
The number of I/Os per package include all user I/Os except the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN, DXP, AND RSVD) and VBATT.
Table 4: Wire-Bond Packages Information Package Pitch (mm) Size (mm) I/Os CS144 0.80 12 x 12 92 FG256 1.00 17 x 17 172 FG456 1.00 23 x 23 324 FG676 1.00 27 x 27 484 BG575 1.27 31 x 31 408 BG728 1.27 35 x 35 516
Table 5: Flip-Chip Packages Information Package Pitch (mm) Size (mm) I/Os FF896 1.00 31 x 31 624 FF1152 1.00 35 x 35 824 FF1517 1.00 40 x 40 1,108 BF957 1.27 40 x 40 684
DS031-1 (v1.7) October 2, 2001 Advance Product Specification
www.xilinx.com 1-800-255-7778
Module 1 of 4 5
Virtex-II 1.5V Field-Programmable Gate Arrays
R
Table 6: Virtex-II Device/Package Combinations and Maximum Number of Available I/Os (Advance Information) Available I/Os Package CS144 FG256 FG456 FG676 FF896 FF1152 FF1517 BG575 BG728 BF957 328 392 408 456 624 516 684 684 684 684 432 XC2V 40 88 88 XC2V 80 92 120 XC2V 250 92 172 200 172 264 172 324 392 528 456 624 720 824 912 824 1,104 824 1,108 484 XC2V 500 XC2V 1000 XC2V 1500 XC2V 2000 XC2V 3000 XC2V 4000 XC2V 6000 XC2V 8000
Notes: 1. All devices in a particular package are pin-out (footprint) compatible. In addition, the FG456 and FG676 packages are compatible, as are the FF896 and FF1152 packages.
Virtex-II Ordering Information
Virtex-II ordering information is shown in Figure 2
Example: XC2V1000-5FG456C
Device Type Temperature Range C = Commercial (Tj = 0C to +85C) I = Industrial (Tj = -40C to +100C) Number of Pins Package Type
DS031_35_033001
Speed Grade (-4, -5, -6)
Figure 2: Virtex-II Ordering Information
Module 1 of 4 6
www.xilinx.com 1-800-255-7778
DS031-1 (v1.7) October 2, 2001 Advance Product Specification
R
Virtex-II 1.5V Field-Programmable Gate Arrays
Revision History
This section records the change history for this module of the data sheet. Date 11/07/00 12/06/00 01/15/01 01/25/01 04/02/01 07/30/01 10/02/01 Version 1.0 1.1 1.2 1.3 1.5 1.6 1.7 Early access draft. Initial release. Added values to the tables in the Virtex-II Performance Characteristics and Virtex-II Switching Characteristics sections. The data sheet was divided into four modules (per the current style standard). Skipped v1.4 to sync up modules. Reverted to traditional double-column format. Made minor changes to items listed under Summary of Virtex(R)-II Features. Minor edits. Revision
Virtex-II Data Sheet
The Virtex-II Data Sheet contains the following modules: * * DS031-1, Virtex-II 1.5V FPGAs: Introduction and Ordering Information (Module 1) DS031-2, Virtex-II 1.5V FPGAs: Functional Description
(Module 2)
* *
DS031-3, Virtex-II 1.5V FPGAs: DC and Switching
Characteristics (Module 3)
DS031-4, Virtex-II 1.5V FPGAs: Pinout Tables
(Module 4)
DS031-1 (v1.7) October 2, 2001 Advance Product Specification
www.xilinx.com 1-800-255-7778
Module 1 of 4 7

▲Up To Search▲

Price & Availability of XC2V1000

	To Download XC2V1000 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .